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Your location: Home > Product Show > Double plate thermal conductivity tester

Double plate thermal conductivity tester

Author: Released in:2024-03-18 Click:13

Double plate thermal conductivity tester

Applicable scope:

Mainly testing the thermal conductivity of various plate-like materials such as plastic, rubber, glass, fiber, benzene board, extruded board, foam concrete, hollow glass, wood board, etc. At the same time, with the help of fixtures, the thermal conductivity of various thermal poor conductors such as granular materials, bulk materials, and soft materials can also be measured.

Compliant with standards:

Executive standard: GB/T10294-2008; Applicable standards: GB/T3399-1982, GB/T10801.1-2002, GB/T10801.2-2002, GB/T3139-2005, GB/T 17794-2008.

Product Description:

The dual plate thermal conductivity tester adopts a high-precision PT100 temperature sensor, imported electronic devices, and a high-precision circuit combined with PC. Achieve complete automation of data collection, processing, storage, and other functions. This device has short measurement time, accurate data, high degree of automation, and low noise.

Product features:

1. Online dual calibration: unique technology that simultaneously calibrates temperature and system errors, accurate, fast, and convenient.

2. Short testing time: The regular testing time is 120-150 minutes.

3. Large measurement range: ranging from 0.001 to 2.000 W/(m • K).

4. Multiple measurement types: In addition to measuring hard boards, various fixtures from the company can be selected to measure various special materials. For example: granular materials, bulk materials, soil, soft materials, etc

5. Online thickness measurement: After the specimen is placed in the furnace, the thickness is measured in real-time under a constant pressure state.

6. The refrigeration adopts a Denver compression refrigeration unit from France, which has the characteristics of stable performance, low noise, and high refrigeration efficiency.

7. The control adopts integrated design such as Japanese PLC and temperature expansion module, which can effectively reduce interference and improve equipment stability.

8. The temperature measurement probe is a high-precision PT100, which improves the accuracy of temperature measurement.

9. The output end adopts a new type of contactless switching device, which has high reliability, long lifespan, low noise, fast switching speed, strong anti-interference ability, and improves the service life and safety of the equipment.

10. The control method is PID control, with a control accuracy of 0.02 °. The PID parameters are adjusted through software self-tuning to ensure tracking accuracy.

11. Independently developed industrial control software, easy to operate and maintain. The software is developed using Visual Basic6.0, with real-time data storage and the ability to continue after power failure. The interface is intuitive, easy to operate, and can be maintained remotely.

12. Adopting RS-232C standard serial communication, experimental data can be synchronously collected. Store data directly in Excel format, making it easy to process.

13. Remote online service: Our customer service personnel maintain and repair through the network; Assist in solving difficult problems; Regularly upgrade software.

Technical parameters:

1. Thermal conductivity measurement display range: (0.001-2.000) W/(m • K);

2. Thermal conductivity measurement accuracy: ± 3%;

3. Repeatability of thermal conductivity measurement: ± 1%;

4. Temperature measurement range of different models of thermal conductivity testers:

Double plate thermal conductivity tester

5. Temperature resolution: 0.01 ℃;

6. Temperature control accuracy: 0.05 ℃;

7. Laboratory temperature: (15-30) ℃, standard temperature: (23 ± 2) ℃;

8. Laboratory humidity: (20-80)% RH, standard (40-60)% RH;

9. Power supply voltage: AC 220V ± 10%, 2.5KW;

10. Test piece: Size: 300mm x 300mm H (5-40) mm; Flatness: 0.1mm; Thickness: Standard 25mm; Thermal resistance: 1) The thermal resistance of the specimen should not be less than 0.1 (m2 • K)/W; 2) The lower limit of the thermal resistance of the specimen can be as low as 0.02 (m2 • K)/W, but it may not necessarily achieve the accuracy of the equipment description throughout the entire range;

11. Clamping force: not greater than 2.5kPa.

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